Partner Sites


X-FAB
X-FAB
Pure play wafer foundry, manufacturing silicon wafers for Analog and Mixed Signal integrated circuits (IC) and application specific integrated circuits (ASIC). Modular CMOS and BiCMOS processes in geometries ranging from 1.0 to 0.18 µm, and special BCD, SOI and MEMS long-lifetime processes.


TSMC
TSMC
Pure play wafer foundry, manufacturing silicon wafers for Digital, Analog, Mixed Signal integrated circuits (IC) and application specific integrated circuits (ASIC). CMOS processes in geometries ranging from 180 to 20nm.


Huahong
Shanghai Huahong Grace Semiconductor Manufacturing Corporation
Pure-play wafer foundries manufacturing wafers for Digital and Mixed Signal integrated circuits (IC) and application specific integrated circuits (ASIC). CMOS processes in geometries ranging from 2.0µm to 90nm.


Unisem
Unisem
Unisem is a global provider of semiconductor assembly and test services for integrated circuits (IC) and application specific integrated circuits (ASIC). Unisem offers an integrated suite of packaging and test services such as wafer bumping, wafer probing, a wide range of leadframe and substrate ASIC packaging, wafer level CSP, and RF, analog, digital and mixed-signal ASIC test services.


ASE Global
ASE Group
The ASE Group is the provider of independent semiconductor manufacturing services in assembly and test for integrated circuits (IC) and application specific integrated circuits (ASIC). The group develops and offers complete turnkey solutions covering ASIC packaging, ASIC package design and ASIC test.


AMKOR
Amkor
Global provider of semiconductor assembly services for integrated circuits (IC) and application specific integrated circuits (ASIC). Amkor provides ASIC packaging, ASIC package design, and ASIC test.