ASIC Packaging - Flexibility

We use first class packaging facilities all over the world to assure high quality, redundant assembly capability. From state of the art chip scale package profiles to die in the waffle pack, we provide our customers with solutions that meet their budget and size objectives.

Click to view our most popular packages.

Options


Miniature

  • QFN
  • CS
  • BGA

I/O

  • 8 to 44
  • 8 to 44
  • 8 to 64
  • 8 to 64
  • 8 to 80
  • 8 to 80

Quad

  • LQFP
  • TQFP
  • MQFP
  • PLCC

I/O

  • 32 to 208
  • 32 to 208
  • 44 to 304
  • 20 to 84

Dual

  • SOIC
  • SOIJ
  • SOP
  • SSOP
  • TSOP
  • TSSOP
  • DIP

I/O

  • 4 to 68
  • 8 to 200
  • 40 to 200

Special Order
Ceramic packages, open cavity, flip-chip and multi-chip modules available on request. Contact System To ASIC for more information.


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