PACKAGING  
 FLEXIBILITY


STA uses first class packaging facilities all over the world to assure high quality, redundant assembly capability. From state of the art chip scale package profiles to DIP style packages, we provide our customers with solutions that meet their budget and size objectives.



 OPTIONS    


DUAL

• SOIC 
• SOIJ 
• SOP 
• SSOP
• TSOP
• TSSOP 
• DIP 


I/O

8 to 44
8 to 44
8 to 64
8 to 64
8 to 80
8 to 80

QUAD

• LQFP 
• TQFP 
• MQFP
• PLCC 

I/O

32 to 208
32 to 208
44 to 304
20 to 84

MINIATURE

• MICRO
• CS 
• BGA 

 

I/O

4 to 68
8 to 200
40 to 200

 
Other options available